Hydrogenated Bisphenol A Epoxy Resin XY518 for 3D Printing & Coatings

Hydrogenated Bisphenol A Glycidyl Ethers XY518
Liquid Hydrogenated Bisphenol A Epoxy Resin

• CAS No. 30583-72-3
• EC No. 500-070-7
• Molecular Formula (C15H28O2*C3H5ClO)x
• 4,4'-Isopropylidenedicyclohexanol, oligomeric reaction products with 1-chloro-2,3-epoxypropane

XY518 is suitable for 3-D printing because it offers:

1. Toughening and property enhancement - When incorporated into a photocurable resin formulation, it significantly increases toughness and impact resistance, solving the brittleness problem of conventional 3-D-printed parts, while also improving UV-yellowing resistance.
2. Low viscosity and excellent flowability - The resin is a clear, low-viscosity liquid (1 500-3 000 cP or 1 500-4 000 cP at 25 °C), which ensures smooth jetting or recoating during stereolithography (SLA) or digital-light-processing (DLP) printing, enabling fine features and complex geometries.
3. Outstanding weatherability - Because the hydrogenated backbone is fully saturated (no double bonds), the printed parts exhibit excellent long-term UV and thermal stability, making them ideal for outdoor applications.

Consequently, this hydrogenated bisphenol-A epoxy resin is widely used as a key component in high-performance, photocurable resins for SLA/DLP 3-D printing, precision prototyping, and durable end-use parts.

• Outdoor weather-resistant coatings
• UV-curable coatings & inks
• Electrical insulation & potting compounds
• LED & semiconductor encapsulants
• Advanced composites & structural adhesives
• Civil engineering & concrete protection
• Military/aerospace coatings & sealants